As the global semiconductor industry accelerates capacity expansion, demand for high-purity process exhaust gas treatment continues to grow. Changzhou Qicheng Environmental has emerged as a key supplier for environmental upgrades among domestic and international semiconductor enterprises, leveraging its customised solutions and specialised adsorbent technologies.
In recent years, the global semiconductor industry has entered a period of rapid expansion, with leading companies such as TSMC, Samsung, and Intel significantly increasing investment in advanced process technologies. This has driven a surge in demand for waste gas treatment solutions across the broader semiconductor manufacturing sector. Statistics indicate that the global semiconductor waste gas treatment equipment market surpassed US$5 billion in 2023, achieving a compound annual growth rate of 12%. Amongst this, technologies for treating challenging pollutants such as PFCs (perfluorocompounds) and acidic gases have become significant industry pain points.
Changzhou Qicheng Environmental Technology Co., Ltd. has seized this market opportunity, leveraging its independently developed core equipment—including the Hybrid Scrubber and Plasma Scrubber—to provide customised exhaust gas treatment solutions for semiconductor manufacturing processes. Utilising advanced technologies such as high-temperature decomposition and plasma catalysis, its equipment efficiently removes over 20 gases including PFCs, NF₃, and HCl, achieving treatment efficiencies exceeding 99%. The systems have obtained authoritative industry certifications such as SEMI S2.
The company's Marketing Director stated that with the acceleration of domestic semiconductor supply chain self-sufficiency and the release of demand from newly constructed wafer fabs in Southeast Asia, Qicheng Environment has established partnerships with multiple multinational FAB manufacturers. Overseas orders surged by 180% year-on-year in 2023. Moving forward, the company plans to further optimise equipment energy efficiency and develop ultra-low emission solutions compatible with sub-2nm processes, thereby supporting the global semiconductor industry's green transition.
